JPH0249329B2 - - Google Patents
Info
- Publication number
- JPH0249329B2 JPH0249329B2 JP57213362A JP21336282A JPH0249329B2 JP H0249329 B2 JPH0249329 B2 JP H0249329B2 JP 57213362 A JP57213362 A JP 57213362A JP 21336282 A JP21336282 A JP 21336282A JP H0249329 B2 JPH0249329 B2 JP H0249329B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- epoxy resin
- phenol
- polycondensate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21336282A JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21336282A JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59105018A JPS59105018A (ja) | 1984-06-18 |
JPH0249329B2 true JPH0249329B2 (en]) | 1990-10-29 |
Family
ID=16637917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21336282A Granted JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59105018A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002220576A (ja) * | 2001-01-26 | 2002-08-09 | Hitachi Chem Co Ltd | 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2675746B2 (ja) * | 1993-10-26 | 1997-11-12 | 松下電工株式会社 | 半導体封止用エポキシ樹脂成形材料 |
US6297332B1 (en) | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
KR101289924B1 (ko) * | 2000-02-15 | 2013-07-25 | 히타치가세이가부시끼가이샤 | 반도체 장치 |
WO2010013406A1 (ja) * | 2008-08-01 | 2010-02-04 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物、およびこれを用いる半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53299A (en) * | 1976-06-25 | 1978-01-05 | Hitachi Ltd | Epoxy resin composition |
JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
-
1982
- 1982-12-07 JP JP21336282A patent/JPS59105018A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002220576A (ja) * | 2001-01-26 | 2002-08-09 | Hitachi Chem Co Ltd | 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等 |
Also Published As
Publication number | Publication date |
---|---|
JPS59105018A (ja) | 1984-06-18 |
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